Diameter (Tolerance): 1.75 mm ± 0.02 mm
Net Weight: 750g
Recommended Printing Temp: 250 – 265 °C
Recommended Printing Speed: 40 – 60 mm/s
Heated Bed: up to 70 °C
Similar to other Nylon materials, PolyMide CoPA has high sensitivity to moisture and should be kept at dry conditions (relative humidity of 20% or less) at all times. We recommend that the material be used with PolyBox (purchased separately).
Moisture-absorbed filament exhibits higher level of stringiness and uneven layers during printing. In case of this happening, the filament can be dried at 70-90 °C for 6-8 hours. However extensive drying can lead to thermal degradation and should be avoided.
For optimum bed adhesion, treat the print bed with a glue stick (Elmer’s or similar brands) before printing. It will also ensure an easy release after printing.
The model cooling fan should be turned off during printing. A retraction distance of 3-6 mm and retraction speed of 2400-3600 mm/min is recommended. The ideal environmental temperature during printing is between 40-70 °C.
For more details or technical questions regarding the use of our products, please leave a message, we will come back to you within 24 hours.
Polymaker is a ISO9001:2008 certified, 3D printing innovation company dedicated to enabling a better future with 3D printing. We achieve this goal by integrating advanced materials, additive manufacturing technologies, and design to meet the needs of today’s industries and consumers.
- Warp Free: PolyMide CoPA is engineered to give excellent dimensional stability during printing, with near-zero warping
- Easy Printing:Unlike other Nylon filaments, PolyMide CoPA is extremely easy to work with. It is compatible with most filament-based 3D printers with no heated chamber/bed required!
- Strong & Tough: The outstanding mechanical strength and toughness makes PolyMide CoPA the best choice of engineering material for your creative ideas!
- Heat Resistant:With a high softening temperature of ~180 °C, PolyMide CoPA is one of the most heat resistant Nylon 3D printing materials in the market.